PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • This electronic component 23 is mounted on the multilayer printed wiring board 15, and comprises a package body 24 accommodating IC, LSI or other chips therein and a plurality of lead wires 25 drawn out from the package body 24.
http://www.w3.org/ns/prov#wasQuotedFrom
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