PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • This property is especially important in the variations to be described below in which the micromechanical devices remain connected to the bonded wafer pair after the bonding layer underlying the micromechanical devices has been removed.
http://www.w3.org/ns/prov#wasQuotedFrom
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