About: http://webisa.webdatacommons.org/52374450

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	This invention relates to a thermocompression bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate plate.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com