PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The following is a description of a first embodiment wherein the present invention has been applied to a vacuum processing apparatus which implements a required processing to a semiconductor wafer under an atmosphere of reduced pressure.
http://www.w3.org/ns/prov#wasQuotedFrom
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