About: http://webisa.webdatacommons.org/52628170

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention is a method for quickly planarizing a surface layer on a semiconductor wafer or other substrate with a fixed-abrasive polishing pad.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com