About: http://webisa.webdatacommons.org/54374782

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	One of the most serious problems inherent in the CMP process is non-uniformity of the polishing rate over the entire surface of an object to be polished, e.g. a semiconductor wafer.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com