About: http://webisa.webdatacommons.org/54452352

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Accordingly, the process conditions, such as the thickness of the dielectric for filling the trench and the etchback time, are substantially the same over the bulk device region and the SOI device region.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com