PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • Also, heat gunning is a bad idea and it is just going to ruin the solder balls under the BGA's as you are pushing too much heat/air onto the solder balls, they need to be slowly increased by a few degrees a second.
http://www.w3.org/ns/prov#wasQuotedFrom
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