| http://www.w3.org/ns/prov#value | - Here, the connection between the micromechanical device 14, the spacer 30, the glass cover 26 and the bottom substrate 28 may be effected by means of e.g. adhering, wafer bonding, anodic or silicon direct-bonding, soldering, connecting by alloying, by means of Solid Liquid Inter Diffusion (SLID) or any other form-fit connection.
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