PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The second interlayer insulating film 3 is formed by using TEOS (tetraethoxysilane) gas and oxygen gas by thermal CVD. The second interlayer insulating film 3 may be formed at a temperature of 680??? C., for example, growing to a thickness such as 100 nm.
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