PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The heat sink device 30 may include a thermal conductive material such as copper, aluminium or other metals.
http://www.w3.org/ns/prov#wasQuotedFrom
  • freepatentsonline.com