About: http://webisa.webdatacommons.org/62525441

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	e bonded, coupling ultrasonic oscillation is imparted in the bonding face so that the semiconductor chip such as the flip chip and the substrate are melted and fixed.
http://www.w3.org/ns/prov#wasQuotedFrom	google.es