About: http://webisa.webdatacommons.org/64149280

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Field of the Invention The present invention relates to semiconductor modules such as a module printed circuit board (PCB) with one or more semiconductor chip packages mounted thereon, and a method of forming the semiconductor module. 2.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com