About: http://webisa.webdatacommons.org/64154169

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Similarly, so-called glob-top encapsulation (with an epoxy, silicone gel, polyimide, and other organic, plastic and the like) of dies mounted and usually wire-bonded to a substrate such as a printed circuit board is also widely employed.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com