PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • In another embodiment, stacked substrates are joined in a separate process by silver sintering (e.g., NTV, LTJT), transient liquid phase soldering (TLP), gluing, or other suitable process.
http://www.w3.org/ns/prov#wasQuotedFrom
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