PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • In this surface grinding step, the back side of the wafer W must be held by, for example, a vacuum chuck device, but it need not be particularly protected by a protective film or the like.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com