About: http://webisa.webdatacommons.org/6943613

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	such as solder balls, are formed on the contact lands, and allow interconnection of the package to another substrate, such as a printed circuit board.
http://www.w3.org/ns/prov#wasQuotedFrom	patents.com