About: http://webisa.webdatacommons.org/69666890

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	A variety of packagings for encapsulating die and interconnects are also known in the art, such as DIP, CERDIP, SOJ, SOP, TSOP, PQFP, LDCC, PLCC, CLCC, PPGA, CPGA, BGA and SBA to name a few.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com