About: http://webisa.webdatacommons.org/70218714

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	on approaches such as SiP, 3-D chip and package stacking and multichip modules have been and are being developed in the industry as an alternative to single chip integration using system on chip (SOC) (Figure 1).
http://www.w3.org/ns/prov#wasQuotedFrom	electroiq.com