About: http://webisa.webdatacommons.org/72649645

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The bond is formed by a suitable adhesive such as an epoxy resin which fills the space between the edges of the flexible material and the semiconductor device.
http://www.w3.org/ns/prov#wasQuotedFrom	google.fr