PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The present invention relates to an electronic device and a manufacturing technique, and more particularly to a technique which is effectively applicable to an electronic device adopting a flip-chip packaging technique.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.es