About: http://webisa.webdatacommons.org/79704564

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	According to the invention as mentioned above, there is an advantage such that all of the various problems in association with the solder bump of the semiconductor package can be solved.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com