PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • The package body 51 will typically be formed from an epoxy molding compound (EMC) or other thermoset polymer composition, but other materials such as ceramics or thermoplastics may be warranted for certain applications.
http://www.w3.org/ns/prov#wasQuotedFrom
  • google.com