| http://www.w3.org/ns/prov#value | - In particular, radiusing the edges 110 of the chip 58 will remove voids, chips and other small defects created at the edges 110, 111 of the chip 58 during scoring and dicing operations. [0037] The third embodiment was illustrated in FIG. 8 using the chip 58, having a domed back surface 64, preferably formed using one of the techniques described above.
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