| http://www.w3.org/ns/prov#value | - In more preferred processes, tin-lead is first stripped from all conductive areas so as to reveal bare copper circuitry, followed by solder masking of all areas other than holes, pads, lands, followed by selective provision of the exposed copper surfaces thereof with solder, such as by hot air solder levelling, immersion tin-lead plating, or the like.
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