| http://www.w3.org/ns/prov#value | - If the microstructures and circuitry are formed monolithically on the same first wafer, then after the sealing wafer is removed, a simple final replacement substrate can be added (e.g. a simple semiconductive or insulating substrate (e.g. a silicon, glass, quartz or other substrate) that is bonded to the first wafer portion at the die level after removal of the sealing wafer portion.
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