| http://www.w3.org/ns/prov#value | - Conventionally, in polishing substrates having features, such as a dual damascenes features formed by the deposition of a barrier layer in an aperture and a conductive material, for example copper, disposed on the barrier layer formed thereon, the conductive material is polished to the barrier layer, and then the barrier layer is polished to the underlying dielectric layer to form the feature.
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