| http://www.w3.org/ns/prov#value | - However, the delamination of aluminum due to the aforementioned probe contact decreases the surface area in which said alloy layer is formed, and as a result there is a problem in that the bonding reliability of the metal wire is decreased. [0005] This problem becomes even more grave as the semiconductor chip becomes smaller and as the bonding pad size becomes smaller as performance increases.
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