About: http://webisa.webdatacommons.org/82906069

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Among the packages for having mounted therein semiconductor chips such as IC, LSI, etc., plastic packages and ceramic packages have recently been used most widely.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com