| http://www.w3.org/ns/prov#value | - A metal wiring layer 22, comprised of a conductive metal, such as tungsten (W), aluminum (Al) or copper (Cu), is then deposited on the barrier layer and patterned via a photolithographic process or a chemical mechanical polishing (CMP) process to form a metal contact in contact with the heavily doped region 12, e.g., a P+ well.
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