| http://www.w3.org/ns/prov#value | - s such as air in the resist 20, the resist 20 cannot be fully filled in the nanostructures 103 formed on the stamp 6. [0013] Because of flatness errors of a stamp for UV nanoimprint lithography and the working surface of a substrate (e.g., 20-30 ??m for a Si wafer substrate), the resist cannot be uniformly imprinted by the stamp during the imprinting process.
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