| http://www.w3.org/ns/prov#value | - If a barrier such as a sandwich of Ti and TiN is used, the deposition can be performed at elevated temperatures, e.g., over 400??? C. and even approaching the melting temperature of the metal (e.g., aluminum), without causing the metal in layer 402 to alloy with or sinter into the barrier metal so as to produce metal ???spikes??? that can short the N+ source region (or the P-body) to the to the ga
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