| http://www.w3.org/ns/prov#value | - After the silicon substrate 1 is mounted on the island 2 and the semiconductor element is electrically connected to the lead terminals, the assembly is encased by the molded resin body 4, which is made of a thermosetting resin such as an epoxy resin or the like, according to a transfer molding process, thereby producing a three-terminal semiconductor device in which the silicon substrate 1 and por
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