| http://www.w3.org/ns/prov#value | - After anodic bonding of wafer 44 to substrate 42, the unwanted portions of wafer 44 can be removed by sawing, laser cutting, etching, or other suitable techniques, as shown in FIGS. 4A and 4B. The remaining covering structure or cap provided by wafer 44 over microstructure 50 is shown in FIG. 4A as being transparent, for purposes of illustration only, to reveal the underlying structures, circuits,
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