| http://www.w3.org/ns/prov#value | - A fourth aspect of the present invention is a method for exposing a photoresist layer on a top surface of a wafer to light, comprising: (a) placing a portion of a top surface of the photoresist layer in contact with an immersion liquid and forming regions of exposed and unexposed photoresist in the portion of the photoresist layer; after (a), (b) removing any immersion liquid remaining on the top
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