| http://www.w3.org/ns/prov#value | - Of course, it will be understood that the IC dice 12 and 26 may be back-bonded using means other than epoxy, and that the wire-bondable pads 30 may be provided on the surface 20 using a method other than screenprinting, such as selective plating.As will be described in more detail below with respect to FIGS. 3A and 3B, it will also be understood that, while the present invention will be described
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