| http://www.w3.org/ns/prov#value | - If water-repellent treatment of the entire surface of the wafer is restricted, a method of locally performing water-repellent treatment or the like is available, with a water-repellent treatment area being limited to a side surface and a peripheral portion of a top surface and a peripheral portion of a bottom surface of the wafer except for the portion to be patterned (hereinafter collectively als
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