| http://www.w3.org/ns/prov#value | - If the laser processing is extended into the substrate 1, the depth of the groove should be at most 1.5 times the thickness of the diamond layer 2, and the laser processing should be performed slowly with sufficient time to avoid adverse thermal effects on the microelectronic elements. [0032] Although a YAG laser was used in this example, another laser such as a CO2 laser or an excimer laser may b
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