About: http://webisa.webdatacommons.org/85916808

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The method of claim 21, wherein the second substrate is a printed circuit board thermally coupled to the bottom surface of the first heat slug.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com