| http://www.w3.org/ns/prov#value | - The method according to claim 11, wherein prior to the step of bonding the thin film piezoelectric to the thin layer structure, further including fabricating the thin film piezoelectric on a substrate, wherein the substrate is other than the silicon wafer, and wherein following the bonding step, removing the substrate from the bonded thin film piezoelectric by a laser lift-off process. 16.
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