About: http://webisa.webdatacommons.org/86065527

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The solder bumps permit the package to be flip chip mounted to a substrate, such as a package substrate, a module substrate or a circuit board.
http://www.w3.org/ns/prov#wasQuotedFrom	google.ca