About: http://webisa.webdatacommons.org/8618282

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	The present invention relates to a semiconductor device, particularly to a semiconductor device of a surface package type including a redistribution wiring and conductive post, and to a method of manufacturing the same.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com