About: http://webisa.webdatacommons.org/86937425

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	Metal bumps can be formed of a conductor such as solder, gold, aluminum, indium or ITO (indium-tin oxide); indium which can be fused at comparatively low temperature is used with particular preference.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com