About: http://webisa.webdatacommons.org/87419702

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	FIG. 7 is a plan view showing the state where bonding pads are provided on the periphery of a chip after completion of wafer processing.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com