PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • After landing pad material 320 has been deposited, sacrificial layer 302 is removed to release device 330 as shown in FIG. 3F. Sacrificial layer 302 may be removed by any suitable method, such as wet etch or other isotropic etch process.
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