About: http://webisa.webdatacommons.org/90102898

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In processing the device, a first layer of metallization, such as aluminum, is formed overlying the surface of the semiconductor device and interconnecting selected ones of device areas on the
http://www.w3.org/ns/prov#wasQuotedFrom	patents.com