| http://www.w3.org/ns/prov#value | - In particular, an etchant or other chemical or mixture of chemicals (e.g., in a liquid or plasma state) that will remove the material of flexible dielectric film 20 at a faster rate than it will remove the material of conductive film 30 is permitted to contact regions of flexible dielectric film 20 that are exposed through apertures 122 of mask 120.
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