PropertyValue
http://www.w3.org/1999/02/22-rdf-syntax-ns#type
http://www.w3.org/ns/prov#value
  • After that, as shown in FIG. 4C, the semiconductor chips 14 are resin-molded with an epoxy resin, such as prepreg, and the resin is thermo-set to form the molding resin 30.
http://www.w3.org/ns/prov#wasQuotedFrom
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