About: http://webisa.webdatacommons.org/92871996

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	FIG. 1 is a diagrammatic sketch in an elevational view showing a semiconductor die affixed to a substrate, having conventional forward wire bond interconnection between the die and the substrate.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com