About: http://webisa.webdatacommons.org/93783809

Property	Value
http://www.w3.org/1999/02/22-rdf-syntax-ns#type	http://www.w3.org/ns/prov#Entity
http://www.w3.org/ns/prov#value	In the chip scale package, the connection may be created by placing the bump connectors, such as solder balls or other conductive bumps, on the pin out pad.
http://www.w3.org/ns/prov#wasQuotedFrom	google.com